SP/SPS- Bis-(sodium sulfopropyl)-disulfide

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MOQ : 50 Kilograms

SP/SPS- Bis-(sodium sulfopropyl)-disulfide Specification

Molecular Weight
354.4 g/mol

Properties
Excellent grain refiner in copper electroplating, high purity, superior stability, and water solubility.

Density
1.7 Gram per cubic centimeter(g/cm3)

Purity
>98%

Product Type
Chemical Compound

Poisonous
NO

Melting Point
>300 C

Application
Electroplating additive, mainly for copper plating baths

Appearance
White crystalline powder

Shelf Life
2 Years

Grade
Industrial Grade

Physical Form
Powder

Taste
Odorless

Shape
Crystalline

Smell
Odorless

Solubility
Highly soluble in water

HS Code
2921

SP/SPS- Bis-(sodium sulfopropyl)-disulfide Trade Information

Minimum Order Quantity
50 Kilograms

Supply Ability
1 Kilograms Per Week

Delivery Time
1 Week

About SP/SPS- Bis-(sodium sulfopropyl)-disulfide

SP/SPS- Bis-(sodium sulfopropyl)-disulfide

CAS Number	27206-35-5
Appearance	White or yellowish powder
pH	3-7(38%water solution)
Packing	25kg
Use	Brightener in copper baths for decorative and functional deposits
Storage	Stored in cool and dry place
Phosphorous acid (as PO33)%	10-100mg/L

Superior Grain Refinement in Copper Plating

SP/SPS stands out for its remarkable efficiency as a grain refiner, delivering smoother, finer copper deposits in electroplating baths. Its reliable action minimizes pitting and promotes a uniform, glossy finish, integral for high-quality copper plating. This powder is frequently adopted by industrial users seeking premium results in electroplating applications.

Outstanding Solubility and Stability

This additive dissolves quickly and completely in water, allowing for easy preparation and integration into copper plating baths. Its crystalline, high-purity form ensures long-lasting stabilitymaintaining effectiveness and consistent properties for up to two years under standard storage conditions.

FAQs of SP/SPS- Bis-(sodium sulfopropyl)-disulfide:

Q: How is Bis-(sodium sulfopropyl)-disulfide (SP/SPS) used in copper electroplating?

A: SP/SPS is added to copper electroplating baths as an additive to refine grain structure, resulting in smoother and brighter copper deposits. It is highly soluble in water, allowing for easy mixing into plating solutions.

Q: What are the main benefits of using SP/SPS in electroplating baths?

A: The primary benefits include enhanced grain refinement, improved deposit smoothness, increased plating stability, and minimized surface defects in copper plating. It also ensures a consistent, high-quality finish due to its high purity and superior stability.

Q: When should SP/SPS be introduced into the electroplating process?

A: SP/SPS should be introduced during the bath preparation or prior to the plating stage to ensure uniform dispersion and optimal grain refining performance throughout the plating cycle.

Q: Where can Bis-(sodium sulfopropyl)-disulfide be sourced in India?

A: This product is readily available from various distributors, exporters, importers, manufacturers, retailers, suppliers, traders, and wholesalers across India. It is supplied to industrial users for copper plating applications.

Q: What is the typical process for using SP/SPS in copper electroplating?

A: The typical process involves dissolving the crystalline powder in water and adding the solution to the plating bath at concentrations recommended by process guidelines. The additive works by refining the grain structure of copper deposits during electroplating.

Q: Is SP/SPS safe to use in industrial environments?

A: Yes, SP/SPS is classified as non-poisonous and is safe to handle with appropriate industrial safety practices. It is odorless and stable, making it suitable for use in manufacturing and plating operations.

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